In view of the complicated structure and limited wiring space of airborne electronic apparatus a novel cabling board wiring design method is proposed to make the wiring technology design better meet the requirement for compact assembling reliable connection and easy maintenance of airborne electronic apparatus .

针对结构复杂、 布线空间受局限的机载电子整机，从工艺角度提出了一种新颖的布线 板布线设计方法，使布线工艺更能适应机载电子整机连接紧凑、可靠、维修方便的要求。

Oilpaper capacity type wall bushing can be divided into two types of vertical and horizontal which is totally sealed and covered with major components such as oil pillow porcelain bushing capacity core connection sleeve and wiring board .

油纸电容式穿墙套管分为立式和卧式两种，均为全密封结构，主要由油枕、瓷套、电容芯子、连接套筒、 接线 板等零部件组成。

Integrated Package Technique of Multilayer Wiring on Silicon Based Board

硅基多层 布线集成组装技术

As a microwave material of new type it is widely used in making electrical components of microwave wiring board for all kinds of needs .

作为一种新型微波材料，广泛用于制作各种需要微波 线路 板的电器元件。

Study on Anticorrosion quality of printed wiring board assembly of oceanographical instruments by salt-mist test

用盐雾试验检验海洋仪器 装配 板耐腐蚀性能的研究

On this case through the completion of manual wiring circuit board design .

本例讲解了通过手工 布线完成电路 板的设计。

Current Condition of Build - up Multilayer Wiring Board in Application Market

积层多层 板应用市场的现状

Copper Foil for the High Density and Super Fine Pattern Printed Wiring Board

高密度超精细 线路印制 板用铜箔

Besides the appropriate grounding filtering wiring of circuit board IC decoupling capacitor and other measures have been taken to improve product performance against interference and electromagnetic compatibility .

并采取了适当的接地，滤波，电路 板 布线，IC去耦等措施来改善产品的抗干扰性能及电磁兼容性能。

Automatic Routing for the Wiring of Multilayer Printed Circuit Board DBX 2

多层印制底板自动布线 系统 DBX2

This paper described the principles of the components distributing and numbering the principles of making the size aperture land and printed wiring certain in the design of printed circuit board . It may help technicians to make perfect design for engineering .

详细阐述了印制电路 板设计中的元器件分布，编号原则以及印制 电路 板尺寸、孔、 连接 盘、 线的确定原则，可为技术人员进行完善的工程设计提供帮助。

Using these characteristics the paper designed the Chebyshev low-pass filter the Biquadratic Elliptic function high-pass filter and manufactured the printing wiring board .

利用这一特点，设计了性价比优越的切比雪夫有源低通滤波器和双二次型椭圆函数有源高通滤波器，并制作了印刷 电路 板。

Sealed wiring and wide application field the solar battery board is used many places require IP65 class to use .

密闭 接线合应用领域广，太阳能电池 板上就用，许多场所要求ip65等级的要用到。

A Method of the General Anlysis of Automatic Wiring on a Two-Layer Printed - Circuit Board

双层印制 板自动 布线总体分析方法

This paper analyses some details in different phases of designing printed wiring board and correct designing steps also introduces some possible questions of laying lines various noises and the solutions .

分析在印制 线路 板设计各个阶段中应注意的细节和正确的设计步骤，给出可能遇到的布线问题，噪声种类及其解决方法。

Impedance Controlling Printed Wiring Board Design Technology for High Frequency Electronic Machine

适用于高频电子机器的阻抗控制印制 线路 板设计技术

Automatic wiring system of printed circuit board

印刷电路 板自动 布线系统

The Questions in Designing Printed Wiring Board and the Solutions

设计印制 线路 板应注意问题及解决方法

Twelve procedures of wiring physical layout and component processing in designing PC board and four ways of shield filter and ground in designing computer system are introduced and five presentations for electromagnetic compatibility design are given .

介绍了在PC 板设计中 走 线、物理布局及元器件处理的12条抗干扰措施和计算机系统设计中屏蔽、滤波和接地的4条建议，最后对电磁兼容设计给出了5条提示。

It includes wiring of printed circuit board electric capacity coupling tolerance of digital circuit noise and transmission line .

其中包括对印制 板 的 布线、电容性耦合、数字电路的噪声容限和传输线的探讨。

Server can also receive control commands through the monitor cabinet controlled internal wiring board the load on the failure to make timely processing power .

也能够接收服务器发出的控制指令，通过机柜监控器内部的受控 接线 板，对出现故障的负载及时做出断电处理。

Extraction of gold from printed wiring board solution with polyethylene glycol-ammonium sulphate aqueous two-phase system

聚乙二醇-硫酸铵双水相萃取废弃印刷 线路 板处理液中的金

Advanced packaging technology represented by CSP and the development of build up-type multilayer printed wiring board ( PWB ) that make such high-density packaging possible are making greatly progress .

以CSP为代表的先进封装技术和可以实现高密度封装的确 积层多 层板的开发已经取得了很大的进步。