vapor barrier

[ˈvepɚ ˈbæriɚ][ˈveipə ˈbæriə]

[机] 蒸汽屏蔽

  • The developed status of thermal barrier coating was reviewed and isothermal and thermally cyclic oxidations of EB-PVD ( electron beam physical vapor deposited ) thermal barrier coatings ( TBC ) were performed .

    评述了热障涂层发展的现状,研究了电子束物理 沉积(EB-PVD) 热障涂层的恒温氧化和循环氧化行为。

  • Application of Thermal-spraying and Electron Beam Physical Vapor Deposition Technologies on Preparation of Thermal Barrier Coatings

    热喷涂及电子束物理 沉积技术在 热障涂层制备中的应用

  • Testing method for water vapor transmission rate of flexible barrier materials

    新型空穴传输材料及 聚碳酸酯的合成柔性 阻挡 材料的水 蒸汽穿透 的试验方法

  • Tanks are insulated by polyurethane foam with a vapor barrier which provides weather protection .

    用聚亚安酯泡沫把储存罐和防止恶劣天气的 蒸气 屏障隔离开。

  • Septum formed by the built-in vapor barrier insulation layer that is vapor layer is separated without a separate isolation air layer .

    所形成内置的隔 屏障,即是保温层又是隔汽层,不需另设隔汽层。

  • Effective Methods of Improving the Water Vapor Barrier Property of Grain Edible Films

    提高谷类可食性薄膜 水汽 阻隔性的有效途径

  • Air-conditioning metal ducts passing through non-conditioned spaces should be wrapped with thermal insulation enclosed in a vapor barrier .

    经过非空调空间的空调金属风道应当用保温材料裹起来,保温材料外面加 防潮

  • How to accurately measure permeation rates of water vapor and oxygen through packaging materials is very important for developing high quality barrier packaging materials .

    而要研制高 阻隔 封装材料,首先要解决如何测量水 蒸气、氧气和其他活性气体对封装材料的渗透率的问题。

  • It is shown that the PT composite films exhibit much better water vapor permeation resistance than PT and these films still keep the high oxygen barrier .

    研究结果表明:与PT单膜相比PT复合材料表现出更好的水 蒸气阻隔性,并且保持了良好的氧气 阻隔

  • Suitable for die-cut shapes shielding moisture and vapor barrier sealing components or lamination to insulation materials .

    适合模切形状,屏蔽,防潮, 防潮密封组件或层压的绝缘材料。

  • Copper thin films were deposited on PI substrates by physical vapor deposition ( PVD ) method . Amorphous TiN film with thickness of 150 nm prepared by PVD was used as a diffusion barrier between Cu on PI .

    采用物理 沉积(PVD)方法在PI基板上沉积Cu薄膜,利用TiN陶瓷薄膜 阻挡Cu向PI基板内部扩散。