Study of Thick Film Process for Carbon Nanotubes Field Emission Cathode

碳纳米管场发射阴极的 厚膜 工艺研究

The thick aluminum film is grown under high temperature in the BCD manufacturing process .

在某一 BCD制程生产 过程中，要求在比较高的温度条件下生长 厚铝。

The influence of operating condition on Gel tape casting process is studied . The bilayers exhibit superior ME coupling compared to thick film composites prepared by tape casting process .

讨论了 工艺条件对成型的影响。相较于涂敷 膜（ tapecasting）复合样品，该双层膜显示出更为优良的ME耦合效应。

Thick Film screen printing is a process in which paste wet the ceramic substrates .

厚膜丝网印刷是浆料润湿陶瓷基板的 过程。

PRIMARY FUNCTION OF POSITION : Responsible for the product modification and localization of thick film materials formula and process developing .

主要工作职责：负责 厚膜 浆料产品的产品研发，本地化， 工艺改进，及 浆料 工艺 方法改进。

This pa-per introduces thick film assembling technique equipment technical parameters and testing methods while narrating the manufacturing process of thick film circuits .

在叙述点火模块厚膜电路的生产 过程中系统介绍了 厚膜封装工艺、相关设备、技术参数和检测方法。

Thick film direct writing process

厚膜直接描绘 工艺

Thick film process used to prepare carbon nanotube ( CNT ) cathode is studied . By investigation of CNT paste and sintering process we can obtain uniform flat CNT thick films with good field emission performance .

研究了制备碳纳米管（CNT）场发射阴极的 厚膜 工艺，通过浆料配方和烧结工艺等方面的探索，在Si基底上制作了均匀、平整、场发射特性良好的CNT厚膜。

Switching power supply based on DC / DC thick film hybrid integrated process is by virtue of its high reliability and are widely used in military aviation aerospace and other fields .

基于 厚膜混合集成 工艺的DC/DC开关电源更是凭借其高可靠性而广泛应用于军工、航空、航天等领域。

Although small driving voltage could be obtained NG FED structure is not suitable for thick film process considering of the process and working principal . So it is difficult to cut down the fabrication cost which is essential for large panel display .

虽然前栅极结构可以获得较小的驱动电压，但是无论从工艺制造还是器件工作特性方面考虑，均不适合采用 厚膜制造 工艺，因此这种结构不易降低制造成本，在大屏幕显示的应用方面非常困难。

Fabricated with thick film process technology the device has the advantages of wide operation range ( 10-48 V ) high output current ( 3 A ) high speed and low power . The use of the device also simplifies the external design of the system .

该电路采用 厚膜 工艺技术制造，具有工作电压范围宽（12~48V）、输出电流大（3A）、速度快、功耗低等特点，简化了外围设计。

The sensor was based on the solid-electrolyte NASICON that was spreaded evenly on the Al2O3 ceramic pipe and then sintered into a thick film . A heating wire passed through the pipe interior providing heat . NASICON was prepared by sol-gel process .

该传感器是将溶胶–凝胶 法制备的NASICON材料均匀涂敷在Al2O3陶瓷管上，烧结形成 厚膜，加热丝穿过管内提供热量。

The thick film NTC thermistors prepared by this thick film pastes have excellent process characteristics and thermal stability above 30 × 10 ~ ( - 2 ) of the quality fraction of the glass agent .

当玻璃助剂质量分数为30×10-2以上时，采用本工艺制备的 厚膜NTC热敏电阻器具有良好的 工艺性和热稳定性。

Based on the structure of ceramic substrate / internal electrodes / thick dielectric film / light-emitting layer / thin dielectric film / ITO the fabrication process of ZnS : Mn phosphor layer has been investigated to improve the brightness of inorganic thick dielectric electroluminescent ( TDEL ) devices .

为了提高陶瓷厚膜无机电致发光显示器的亮度，采用陶瓷基片/内电极/陶瓷 厚膜/发光层/上绝缘层/透明电极的器件结构系统研究了ZnS∶Mn发光层的制备 工艺。

The performance of thick film paste for AlN substrate was summarized relating to manufacture of metallic powder study of bonding manner and improvement on firing process .

介绍了AlN基片所用 厚膜浆料的产品性能。从金属粉体的制备，粘结方式探索和烧结 工艺的改进等方面综述了该领域的研究进展。

During the growth of diamond thick film in EACVD process the substrate temperature hot-filament temperatare / current and gas supply flowrate are all the important parameters .

在 EACVD金刚石 膜生长 过程中，衬底温度、热丝温度、热丝电流和气源流量等是其重要的工艺参数。

The customer can use OPP by standard thick film printing process with curing temperature 200 ℃ .

采用 厚膜印刷 工艺，200℃固化。