The thick-film technology was applied to assemble the module circuit devices on a 10mm × 15mm alumina substrate .

应用 厚膜 电路技术，将电路所用器件装在-10mm×15mm的氧化铝 基 片 上。

A novel technique of laser micro-cladding is used to flexibly and directly fabricate thick-film resistors on ceramic substrate .

采用激光微细熔覆柔性直写技术在陶瓷 基板 上制备 厚膜电阻。