The Advances in Wafer Bonding and MEMS

晶圆键合技术与微电子机械系统新进展

The method is to coat a wafer of silicon with a protective layer of silicon dioxide .

其方法是往 硅片上涂上一层二氧化硅防护膜。

Wafer swing check valve is used to prevent media from flowing backwards in pipeline and device ;

对 夹止回阀是用于防止管道和设备使用中介质倒流的一种阀门；

Integration and Packaging of Sensors and MEMS Devices Through Low Temperature Wafer Bonding

圆片包封瓷介电容器用低温 圆片键合实现传感器和微电子机械系统器件的集成和封装

Crater - Visible under diffused illumination a surface imperfection on a wafer that can be distinguished individually .

微坑-在扩散照明下可见的， 晶 圆片表面可区分的缺陷。

Wafer Die Disposition : Various functions related to wafer manufacturing and test .

WaferDieDisposition：各种与晶片制造及测试相关的功能。

A vacuum clamp equipment used for holding Si wafer is designed in this paper .

设计了一套 硅片专用真空夹紧装置，包括夹紧装置和 微型无油真空抽气泵。

In this paper we develop an automatic wafer inspection system .

在这一篇论文中，我们发展了一个自动化 晶圆检验系统。

In one variant of this process the bumps are etched onto the tape rather than deposited on the wafer .

这种工艺有一种方式是，凸出物被蚀刻在带上，而不是沉淀在 硅片上。

Smudge - A defect or contamination found on the wafer caused by fingerprints .

污迹- 晶圆 片上指纹造成的缺陷或污染。

This paper introduces the technology of solid membrane transfer by wafer bonding and its applications .

阐述了利用 键合方法转移薄膜材料的技术及其应用。

Motion control system of an ultra precision wafer stage with application to integrated circuit production was presented .

描述一种应用于集成电路制造的超精密 硅片台系统及其运动控制。

Disclosed is a method and system for testing IC in wafer stage by using passive electric network .

公开了一种利用无源电气网络进行 晶片阶段集成电路测试的方法和系统。

Embodiments of the disclosure include use as a wafer level underfill and an encapsulant for electronic chips .

本发明的实施方案包括作为 晶片级底层填料和电子芯片密封剂的用途。

The application of wafer bonding technology in long ? wave vertical cavity devices is given .

最后介绍了 晶片键合技术在长波长垂直腔型器件研制中的应用。

Bond strength is an important parameter for wafer bond .

键合强度是关系到 键合 好坏的一个重要参数。

Waves-curves and contours found on the surface of the wafer that can be seen by the naked eye .

波浪-晶 圆片表面通过肉眼能发现的弯曲和曲线。

To smooth the surface of a wafer or semiconductor crystal .

使 晶片或半导体晶体的表面光滑的过程。

In this paper part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented .

本论文对紫外激光应用于蓝宝石 晶圆和碳化硅等材料的划切加工技术进行了部分理论与试验研究工作。

The tool is capable of fast2D and3D mapping of Stress or wafer bow .

设备可以快速对应力和 硅片翘曲度进行2D和3D映像；

Now people can produce a wafer silicon .

现在人们能够生产一种 硅 晶 薄片。

Hot plate with silicon wafer in initial configuration ( before heating ) .

加热板与矽 晶圆在启始状态（加热前）。

Nanya forwarded a shipment of wafer to us .

南亚发了一批 晶圆给我们。

This market research report covers the2008 silicon wafer reclaim for the semiconductor market and provides a forecast to2011 .

该市场调研报告涵盖了2008年半导体市场的 硅片回收状况以及对于2011年的预测。

Based on the classification on the scheduling for semiconductor wafer lines the modular and reconfigurable framework is proposed .

在分析 半导体 生产线调度分类的基础上，提出了组件化可重构半导体生产线调度体系结构。

A thin crisp wafer made or flour and water with or without leavening and shortening ; unsweetened or semisweet .

面粉和水做成的、发酵或不发酵、酥松或不酥松的薄脆 饼干；未加糖或半甜。

The Endura platform is a modular configurable system used to deposit metals and metal alloys on the wafer .

Endura平台是一个模块化、可配置系统，用于将金属和金属合金安装到硅 晶片。

Abstract : this paper introduces the background of using wafer level reliability technology and expounds the characteristics and functions in details .

摘要：介绍了 圆片级可靠性技术产生的背景，对其特点和作用作了详细的论述。

Methods and systems of diagnosing an arcing problem in a semiconductor wafer processing chamber are described .

本发明揭露一种诊断半导体 晶圆处理室中的电弧问题的方法及系统。

Study on Dynamic Pressure and Temperature of Slurry in Chemical-Mechanical Polishing of Silicon Wafer

硅片化学机械抛光加工区域中抛光液动压和温度研究