The parameters of FAB ( free air ball ) process during copper wire bonding were optimized .
对 铜丝 球 键 合 焊形球过程FAB参数进行了优化。
Detailed study of the device wire bonding process on the damage and failure mechanism of the device .
详细研究了器件 焊 线（ 键 合）过程对器件的损伤及其失效机理。
Wire bonding is still the most popular interconnect technology in the first-level packaging .
一级封装中最流行的互连技术仍为 丝 焊。
The methods of3D interconnection can be classified into the wire bonding flip chip through silicon via ( TSV ) and film wire technology whose advantages and disadvantages are analyzed .
将实现3D互连的方法分为 引线 键 合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。
Metal wire bonding interconnection is the key means in the internal matching technology of RF power transistor .
金属 键 合线互连是射频大功率晶体管内匹配技术中的关键手段。
Evaluation of Bondability and Reliability of Single Crystal Copper Wire Bonding in Semiconductor Packaging ; transistor-transistor logic
单晶铜丝在半导体器件封装中的打 线 键 合性能研究晶体管-晶体管逻辑电路
Research of Ultrasonic Power Supply in Wire Bonding Based on FPGA
基于FPGA的 引线 键 合超声电源的研究
Effect Factors Analysis of Wire Bonding Quality on Microwave Circuit
微波电路 引线 键 合质量的影响因素分析
The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated .
纯锡焊料凸块和含钴底部凸块 金属 焊 层 结合可延长无铅焊接倒装片的寿命。
Now wire bonding has been the most popular interconnection technique in semiconductor device packaging .
目前， 引线 键 合 技术已经成为半导体封装中广泛应用的互连方法。
Twisted-pair were in the wire bonding method sometimes used for coaxial cable the method can make it smaller lighter cheaper .
在双绞线中 黏合 导线的方法有时也用于同轴电缆，这种方法能使其更小、更轻、更便宜。
Wafer chip scale packaging ( WCSP ) eliminates conventional packaging steps such as die bonding wire bonding and die level flip chip attach processes .
晶圆级芯片尺寸封装（WCSP）消除了类似传统的芯片键合、 引线 键 合和倒装芯片贴装过程的封装工序。
Simulation and Study of Ultrasonic Vibration Propagation in Wire Bonding System
超声振动在 引线 键 合系统中的传播仿真与研究
With the development of the integrated circuit industry the welding speed and welding line quality of the wire bonding machine appear new demands and challenges .
随着集成电路行业的发展，对 引线 键 合机的焊线速度和质量提出了新的要求和挑战。
The paper takes the IC-encapsulation equipment & semi-automatic ultrasonic wire bonding machine as the control object .
论文正是以IC封装设备&半自动超声波 焊 线机为控制对象。
Many factors would affect wire bonding process .
引线 键 合过程中有很多因素会对 键 合 质量产生影响。
Wire bonding is the most classical and most mature technique for IC interconnection which takes most of the market share there are also a lot of research on ultra-fine-pitch wire interconnection must to do .
摘要 引线 键 合是应用时间最长、技术最为成熟且目前市场有率最高的芯片连接技术，但应用于超细间距引线互连还有许多技术有待研究。
Design of High-frequency Ultrasonic Transducer for Wire Bonding and Research on Motion Control of Bond Head
引线 键 合高频超声换能器的设计和键合头运动控制研究
In ultrasonic wire bonding process the bonding pressure is one of the most important factors to the bonding strength .
在超声 引线 键 合过程中，键合压力是影响键合强度的重要因素之一。
Finally wire bonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design .
最后用正交试验的方法对肖特基器件后部封装中的压 焊工艺进行了参数优化设计。
To improve the speed and accuracy of automatic frequency tracking on thermosonic wire bonding the design scheme based on FPGA was proposed .
为进一步提高热超声 引线 键合超声电源的自动频率跟踪速度及精度，提出了基于现场可编程门阵列（FPGA）的超声电源设计方案。
Ribbon wire bonding is different from conventional wire bonding technology .
引线带楔焊 键 合和引线（圆形）楔 焊 键 合是不同的。
Another focus was on how the operating parameters affect the ultrasonic wire bonding .
分析了各工作参数对超声波 线 焊产生的影响。
Taguchi method ; Soft algorithms ; Wire bonding process .
田口方法；柔性演算法； 焊 线 制程。
Thermal-structural analysis was performed for ultrasonic wire bonding ( UWB ) by three dimensional finite element method ( FEM ) .
用三维有限元方法对超声波 线 焊进行了瞬态的热-结构分析。
Considering these factors the flowing two parts should be considered in the wire bonding process : Free air ball formation and Looping stability .
对应于这些参数在 焊 线机制程的 关键 技术，可分为 金线结球及 焊 线路径稳定性两个部分。
In addition the optimum wire bonding of several of the electrode material had been discussed .
另外，探讨了几种电极材料的 引线 键 合的最佳工艺。
Design of welding pressure control system for ultrasonic gold wire bonding machine
超声波 金丝 球 焊 线机焊接压力控制系统设计
美[waɪr ˈbɑndɪŋ]英[ˈwaiə ˈbɔndiŋ]
（集成电路）引线接合法