Development of Core Wafer Core Materials for Use as Dual Sound Track Magnetic Head

双声道磁头用 芯片材料的研制

Single crystal silicon wafer has been widely used in the semiconductor industry as the basic substrate material for the integrated circuits . Ultra-precision grinding technology is the core technology of a semiconductor chip substrate planarization processing and back thinned processing .

单晶硅 是 优良的衬底材料，被广泛应用于半导体产业中，超精密磨削技术是半导体芯片衬底平坦化加工和背面减薄加工的 核心技术。

Wafer handling robot is automated material handling equipment used in Lithography machine which is the core of semiconductor manufacturing equipment . Its working speed positioning accuracy reliability cleanliness impact on the lithography process directly in the production efficiency and manufacturing quality .

光刻机是半导体制造的 核心装备， 硅片 传输机器人是其内部专用的自动物料处理设备，它的工作速度、定位精度、可靠性，使用洁净度等直接影响光刻工序中的生产效率和制造质量。

Investigation of Cheap Hard Permalloy MH-1 for Use as Wafer Core of Magnetic Head

磁头 芯片用廉价硬坡莫合金 MH-1的研究

A chip on the other hand is a silicon wafer that a core resides on .

而芯片（chip）是将 核心封装起来的一块 硅片。

Step-scan lithography machine is the core device in the semiconductor manufacturer industry and the wafer stage system is core system of the lithography machine .

步进扫描光刻机是半导体制造的核心装备，而 工件台系统是光刻机整机系统的 核心系统。