In order to gained a copper surface of high quality and unknit the experiments that copper was polished using colloidal silica slurry on fixed conditions were done in which the curve of mechanical reaction between the concentration of abrasive particles and polishing rate was found .

为得到高质量、 高平 整 度的铜表面，采用SiO2溶胶抛光液对铜进行抛光实验，在给定的条件下，得到了磨料粒子的浓度与抛光速率间的机械作用曲线。