Experiment and Study on Straw Wafering With Open End Die

秸秆 开模 压 饼 工艺的试验研究

Surface quality and oxygen precipitation ( OP ) of the polished Czochralski ( Cz ) silicon wafers are of significance for manufacturing yield of integrated circuits ( ICs ) . The Cz silicon wafers are generally subjected to high temperature anneal in either silicon wafering or IC fabrication processes .

直拉硅抛光片的表面质量和氧沉淀对集成电路成品率的影响 很大。无论在 硅片生产还是在集成电路制造中，硅片都要经过高温退火。

The manufacture technique of silicon carbide single crystal consists of single crystal growth and wafering .

对于碳化硅单晶材料制备技术而言主要是由晶体生长技术和 晶片的加工技术 共同 构成， 二 者 缺一不可。